发明名称 |
Method for partially plating on a base |
摘要 |
<p>There is provided a method for partially plating on a base of synthetic resins or other materials including not only a single base but an assembly thereof comprising a number of chip bases for producing electronic and electric parts such as printed circuit board, lead frame insert molded circuit parts, etc. A method for partially plating on an assembly of bases 21 by the use of a plating catalyst comprising a coating process to coat a surface to be plated or not to be plated by means of a coating material selected from a water soluble polymer or hydrolyzable polymer either before or after a catalyst applying process to soak a container containing bases 21 in a plating catalyst bath.</p> |
申请公布号 |
EP1111090(A2) |
申请公布日期 |
2001.06.27 |
申请号 |
EP20000127802 |
申请日期 |
2000.12.19 |
申请人 |
ITOH, RYOH;SUMITOMO SHOJI PLASTICS CO., LTD. |
发明人 |
ITOH, RYOH |
分类号 |
H05K1/00;C23C18/16;H05K3/00;H05K3/06;H05K3/18;(IPC1-7):C23C18/16;H01L21/48 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|