发明名称 Method for partially plating on a base
摘要 <p>There is provided a method for partially plating on a base of synthetic resins or other materials including not only a single base but an assembly thereof comprising a number of chip bases for producing electronic and electric parts such as printed circuit board, lead frame insert molded circuit parts, etc. A method for partially plating on an assembly of bases 21 by the use of a plating catalyst comprising a coating process to coat a surface to be plated or not to be plated by means of a coating material selected from a water soluble polymer or hydrolyzable polymer either before or after a catalyst applying process to soak a container containing bases 21 in a plating catalyst bath.</p>
申请公布号 EP1111090(A2) 申请公布日期 2001.06.27
申请号 EP20000127802 申请日期 2000.12.19
申请人 ITOH, RYOH;SUMITOMO SHOJI PLASTICS CO., LTD. 发明人 ITOH, RYOH
分类号 H05K1/00;C23C18/16;H05K3/00;H05K3/06;H05K3/18;(IPC1-7):C23C18/16;H01L21/48 主分类号 H05K1/00
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