发明名称 HOT MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a hot melt adhesive composition reducing melt viscosity without damaging its original adhesion performance, improving workability, usable for more general purposes. SOLUTION: This hot melt adhesive composition comprises a structural unit excluding a reactive unsaturated bond, and includes a resin composition having a heat reversible cross-link formed by reacting a basic metal compound and a polyurethane resin having a carboxyl and excluding ester bond.
申请公布号 JP2001172601(A) 申请公布日期 2001.06.26
申请号 JP19990358933 申请日期 1999.12.17
申请人 JAPAN U-PICA CO LTD 发明人 KUWABARA MITSURU
分类号 C09J175/04;C09J11/04;(IPC1-7):C09J175/04 主分类号 C09J175/04
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