| 摘要 |
The present invention relates to a method for manufacturing a printed circuit board The method for manufacturing a printed circuit board of the present invention comprises opening resin holes in a copper plate, filling second resins such as epoxy resins in the resin holes, attaching first metal foils such as copper foils through first resins such as polyimide resins dissolved in solvents on the copper plate, selectively etching the first metal foils, attaching second metal foils through the first resins dissolved in a solvent on both the faces, selectively wet-etching the second metal foils, irradiating laser beam over the resulting thereby exposed first resins to open a connection holes in the second metal foils and resin layers consisting of the first resin, electroless copper plating and subsequent electrolytic copper plating to form copper-plated layers on both the faces, and thereafter selectively etching the second metal foils and the copper-plated layers.
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