| 发明名称 |
Semiconductor device and its wiring and a fabrication method thereof |
| 摘要 |
A semiconductor device and a wiring therefor and a fabrication method thereof are disclosed, which are capable of providing a good current driving capability without degrading the characteristic of the semiconductor device by overcoming the problems encountered in the known semiconductor device, and a wiring is implemented by using e semiconductor device fabricated in accordance with the present invention.
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| 申请公布号 |
US6251760(B1) |
申请公布日期 |
2001.06.26 |
| 申请号 |
US19990233171 |
申请日期 |
1999.01.19 |
| 申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO. LTD. |
发明人 |
SON JEONG-HWAN |
| 分类号 |
H01L21/28;H01L21/3205;H01L21/336;H01L23/52;H01L29/49;H01L29/78;(IPC1-7):H01L21/320;H01L21/476;H01L21/44 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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