发明名称 RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin molding apparatus capable of extruding a molding resin housed in a pot by a plunger to mold the same in such a state that the extrusion pressure of the molding resin by the plunger is stabilized even if molding is repeated. SOLUTION: In a resin molding apparatus wherein a pot 1 capable of housing a molding resin and the cylindrical plunger 2 provided in the pot 1 in a freely slidable manner are provided and the molding resin housed in the pot 1 is extruded by the plunger 2 to be supplied into a mold to be molded, a ring-shaped packing 5 is provided on the outer peripheral surface 4 of the plunger 1 opposed to the inner wall surface of the pot 1 to keep the width of the clearance part 7 between the inner wall surface 3 of the pot 1 and the outer peripheral surface 4 of the plunger 2 constant and an air discharge port 8 for discharging the air in the pot 1 to the outside when the molding resin is extruded by the plunger 2 and the air discharge passage 9 communicating with the air discharge port 8 are formed.
申请公布号 JP2001170958(A) 申请公布日期 2001.06.26
申请号 JP19990357527 申请日期 1999.12.16
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAKUMA SHOICHI
分类号 B29C45/02;B29C45/58;(IPC1-7):B29C45/02 主分类号 B29C45/02
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