| 摘要 |
A method, which is for forming accurate low wire loop shapes or short wire loop shapes which are stable and which have a high shape retention force in devices in which height differences between first and second bonding points are small and the wiring distance is short, including the steps of bonding a ball formed at the end of the wire extending out of the capillary to the first bonding point, raising the capillary while delivering the wire, moving the capillary toward the second bonding point, and then raising the capillary diagonally upward.
|
