发明名称 Sealed-cavity microstructure and microbolometer and associated fabrication methods
摘要 A sealed-cavity microstructure and an associated method for manufacturing the microstructure. Specifically, the microstructure includes first and second wafers that are positioned relative to one another so as to form a cavity between the wafers. The microstructure further includes a seal between the first and second wafers and surrounding the cavity to create a pressure seal for the cavity. This seal allows the cavity of the microstructure to be maintained at a predetermined pressure different from that of the atmosphere outside the cavity. Importantly, the microstructure further includes a structural bond between the first and second wafers that structurally integrates the first and second wafers. The structural bond renders the microstructure more rugged such that the microstructure can withstand expansion, vibrational, and shock stresses experienced by the microstructure during subsequent manufacturing and use. In one additional embodiment, the microstructure is a microbolometer that includes in addition to the seal and structural bond, a radiation detector suspended in the cavity.
申请公布号 US6252229(B1) 申请公布日期 2001.06.26
申请号 US19980113472 申请日期 1998.07.10
申请人 BOEING NORTH AMERICAN, INC. 发明人 HAYS KENNETH MAXWELL;BISIGNANO ALAN GLENN;FITZGIBBONS EUGENE TIMOTHY
分类号 G01J5/20;(IPC1-7):H01L31/020 主分类号 G01J5/20
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