发明名称 PHENOL RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a phenol resin molding material slightly causing burr in molding. SOLUTION: This phenol resin molding material is characterized in that 100 pts.wt. of a phenol resin is compounded with 150-500 pts.wt. of a filler having a peak of distribution at 30-50μm and >=90% distribution of particles having 1-100μm particle diameter.
申请公布号 JP2001172470(A) 申请公布日期 2001.06.26
申请号 JP19990364192 申请日期 1999.12.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 MURAYAMA HIDEKI
分类号 C08L61/06;C08K3/00;C08L97/02;C08L101/00;C08L101/16;(IPC1-7):C08L61/06 主分类号 C08L61/06
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