REDUCTIVE ACTIVATION TREATING SOLUTION FOR ELECTROLESS NICKEL PLATING AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD USING SAME

摘要

PROBLEM TO BE SOLVED: To produce a reductive activation treating solution for depositing a nickel-gold plating film suppressed in the generation of the unevenness of whiteness and excellent in reliability on packaging and to provide a method for producing a printed circuit board using same. SOLUTION: This solution is obtained by dissolving a reducing agent into an aqueous solution of an inorganic base, particularly the reducer is composed of sodium hypophosphite or potassium hypophopshite, the aqueous solution of an inorganic base is the one in which hydroxide composed of sodium hypophosphite or potassium hypophosphite is dissolved, and pH is controlled to 9 to 13.