| 摘要 |
PROBLEM TO BE SOLVED: To obtain a build-up insulating resin composition for multi-layer printed-wiring boards having excellent storage stability, reduced temperature dependence of volume resistivity after curing and most suitable for via holes by laser. SOLUTION: The insulating resin composition for multi-layer printed-wiring boards comprises a monomer having at least one ionically polymerizable functional group, a polymeric compound having at least one ionically polymerizable functional group, and a heat activation ionic polymerization catalyst which has a >=10C substituted or nonsubstituted hydrocarbon group or at least one cyclic organic structure having a >=10C substituted or nonsubstituted hydrocarbon group in the molecule and can effect dissolution and deposition by heating and cooling, respectively.
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