| 发明名称 |
Direct contact through hole type wafer structure |
| 摘要 |
A direct contact through hole type wafer structure. Both sides of a wafer have devices and contacts. The contacts are coupled with the devices. Bumps are formed on the contacts, respectively.
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| 申请公布号 |
US6252300(B1) |
申请公布日期 |
2001.06.26 |
| 申请号 |
US19990260218 |
申请日期 |
1999.03.01 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
HSUAN MIN-CHIH;HAN CHARLIE |
| 分类号 |
H01L21/60;H01L21/768;H01L23/48;H01L25/065;(IPC1-7):H01L23/02;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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