发明名称 RESIN BOARD CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To restrict generation of chips by cutting a resin board at once. SOLUTION: A current is supplied to metal wires 13 by a power source 11 to generate Joule's heat J. All the metal wires 13, 13... are simultaneously pressed to a resin board 14 to fusion-cut it into strips. The resin board 14 can thus be efficiently cut in a short time. Since the resin board 14 is thus fusion-cut, generation of chips can be prevented. Contamination on action parts of optical elements mounted on the separated strips of the resin board 15 to deteriorate functions of the optical elements can thus be prevented.
申请公布号 JP2001170899(A) 申请公布日期 2001.06.26
申请号 JP19990358918 申请日期 1999.12.17
申请人 SHARP CORP 发明人 KAMIMURA HIRONORI
分类号 B26F3/12;(IPC1-7):B26F3/12 主分类号 B26F3/12
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