MOLDING MATERIAL, ELECTRONIC PART AND METHOD FOR MANUFACTURING MOLDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a molding material which inhibits the generation of voids in a molding and at the same time, minimizes the loss of a material during molding when a platelike or a sheetlike molding is obtained and is best suitably used for molding the insulating layer of an electronic part. SOLUTION: A powdery resin composition 3 is tableted and thereby is molded into the sheetlike or the platelike tablet. Thus it is possible to prevent the working environments from being deteriorated by dust, compared to the case in which the composition 3 is handled in a powdery condition and also improve the ease of handling the composition 3 during conveyance in the form of the tablet, compared with the case with the handling in the form of powder. In addition, no solvent is left in the molding material and also sticks to a mold and the like during molding. Besides, the peeling properties of the composition 3 in the form of the tablet are remarkable when the tablet is thermally molded under pressure. The tablet can be as such thermally molded under pressure into the sheet or the plate and thereby the generation of voids in this molding can be inhibited.