发明名称 |
METHOD FOR FORMING BURRING AND DIE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming burring and a die device by which a final collar is formed high and into uniform thickness by obtaining the uniform thickness without loading concentrated tensile load in the preforming of a metal plate. SOLUTION: When a part of the metal plate 27 where the burring is performed is preformed, by using a knock-out collar provided with a recessed part for relief on its bottom end surface, the metal plate 27 is pressed with a forming punch 20 in the state where the metal plate 27 is not held with the knock-out collar 7 and the forming punch 20, and a stretch forming part 32 is preformed.
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申请公布号 |
JP2001170715(A) |
申请公布日期 |
2001.06.26 |
申请号 |
JP19990355214 |
申请日期 |
1999.12.15 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TANSHIN MASAYA;MURAKAMI TOSHIRO;KIKUCHI AKIHITO;YADA TATSUYA |
分类号 |
B21D19/08;B21D28/10;B21D37/08;(IPC1-7):B21D28/10 |
主分类号 |
B21D19/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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