| 发明名称 |
Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device |
| 摘要 |
Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.
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| 申请公布号 |
US6252010(B1) |
申请公布日期 |
2001.06.26 |
| 申请号 |
US19980181678 |
申请日期 |
1998.10.29 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKEUCHI KAZUMASA;SAITO TETSUYA;NANAUMI KEN |
| 分类号 |
B32B15/08;C08G18/32;C08G18/34;C08G18/61;C08L63/00;C08L79/08;C09D183/10;C09J7/02;C09J179/08;H01L21/58;H01L23/29;H01L23/498;(IPC1-7):C08L83/08;C08G77/26 |
主分类号 |
B32B15/08 |
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