| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper plating method by which the formation of a releasable film of a sulfurous compound contained in a brightener or a hardener is inhibited before a nickel-plated face is plated with copper to increase the adhesion between the nickel-plated face and copper-plated face, and the copper plating is never released from the nickel-plated face as if it were Ballard plating when a high polishing pressure is exerted. SOLUTION: A low voltage not causing an electrolytic burnt deposit is applied on a nickel-plated roller R to rotate the roller, the roller is brought into contact with a copper plating solution to plate the whole face with copper, and then the voltage is raised to a plating voltage to perform copper plating.
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