发明名称 |
ELECTRICALLY CONDUCTIVE ADHESIVE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive having adhesivity and reworkability which are incompatible properties in electrically conductive adhesives and having balanced low-temperature connectivity, high electrical conductivity and high connection reliability. SOLUTION: The objective electrically conductive adhesive contains an electrically conductive filler and an organic binder. Lead is absent in plural constituent metals of metal particles in the electrically conductive filler, the concentration of the constituent metal continuously varies between the surface of the metal particle and the inner part of the particle and the particle has a low-melting layer on the metal particle surface melting at a temperature near the curing temperature of the organic binder and a high-melting layer in the inner part of the metal particle.
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申请公布号 |
JP2001172606(A) |
申请公布日期 |
2001.06.26 |
申请号 |
JP19990362230 |
申请日期 |
1999.12.21 |
申请人 |
ASAHI KASEI CORP |
发明人 |
NAKADA SHUICHI;SHIMAMURA YASUKI |
分类号 |
H01B1/00;C09J9/02;C09J201/00;H01B1/22;(IPC1-7):C09J201/00 |
主分类号 |
H01B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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