| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having excellent characteristics of humidity resistance and solder crack resistance. SOLUTION: This epoxy resin composition for sealing semiconductors is characterized in that the composition comprises (A) an epoxy resin obtained by compounding a bisphenol F (a) of general formula (1) (R1s are each a 1-6C alkyl group and may be the same or different; (a) is an integer of 0 to 4) with a phenol (b) being a precursor of crystalline epoxy resin and glycidyletherifying the mixture, (B) a phenol resin of general formula (2) (R2s and R3s are each a 1-6C alkyl group; (b) is an integer of 0 to 3; (c) is an integer of 0 to 4 and they may be the same or different; (m) and (n) are each an average value and are each a positive number of 1 to 10 or (m) is a positive number of 1 to 10 and (n) is 0), (C) an inorganic filler and (D) a curing promoter as essential components.
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