Binder resins for crp backed copper foil - laminates for printed circuit boards

摘要

Mould lamination of copper foil with a mat or resin bonded continuous glass fibres impregnated with a polymerisable composition where the glass is bound by an unsaturated polyester resin and the impregnation resin is a mixture of methylmethacrylate (pref. polymer dissolved in more monomer) and an unsaturated polyester pref. also containing an epoxide resin. The foil and fibre layers are bonded to form laminates for making printed circuit boards (by selective etchings) featuring a high surface polish and flex resistance.