| 摘要 |
A package for housing optical components where the enclosure has two enclosures. The first enclosure for the optical components (the optical enclosure) provides necessary alignment and hermeticity as well as a heat pipe to dissipate heat generated by the optical component. The second enclosure for the electronic components (the electronic enclosure) provides proper hermeticity and heat dissipation devices (e.g., a Peltier cooling device). The first enclosure can sit atop the second enclosure or vice versa. In an embodiment, a heat sink can be attached to the top of the dual-enclosure assembly.
|
