Electromagnetic interference cover for a conduit and an electronic equipment chassis employing the same

摘要

For use with an electronic equipment chassis having a module support member adapted to receive an electronic module and having a conduit containing an electrical conductor proximate the module support member, an electromagnetic interference (EMI) cover, method of manufacturing the EMI cover and electronic equipment chassis employing the same. In one embodiment, the EMI cover includes a conductive body that substantially conforms to the conduit and a boss extending from the conductive body and configured to contact a conductive case of the electronic module. The boss provides a conductive path between the conduit and the electronic module to establish a common voltage potential therebetween thereby reducing EMI emissions associated with the electronic module.