发明名称 Semiconductor memory device having improved row redundancy scheme and method for curing defective cell
摘要 A semiconductor memory device having a row redundancy scheme in which the time to enable a word line during a normal path is less than that of a conventional device, to enhance the operation speed of a memory chip, and the number of common redundancies are maximized to enhance the redundancy capability, and a method for curing a defective cell. The semiconductor memory device has a plurality of global blocks, each of which includes a plurality of unit matrixes having a normal block and a redundancy block, a normal division word line driver, a redundancy division word line driver, a main decoder and an auxiliary decoder. In the main decoder, an output signal is selectively activated according to a row address signal regardless of using the redundancy cell. Also, in the auxiliary decoder, when a corresponding global block is selected according to the row address signal for selecting a global block in a normal operation mode or a redundancy scheme of the corresponding block is used in the redundancy operation mode, an output signal is selectively activated according to the row address signal.
申请公布号 US6252808(B1) 申请公布日期 2001.06.26
申请号 US19970001712 申请日期 1997.12.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOO JEI-HWAN
分类号 G11C29/04;G11C11/401;G11C29/00;(IPC1-7):G11C7/00 主分类号 G11C29/04
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