发明名称 SOLVENTLESS TWO-PACK TYPE CURABLE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a solventless two-pack type curable adhesive composition free from generation of blocking due to leak of adhesive from a metal foil and a laminating method. SOLUTION: This solventless two-pack type curable adhesive composition includes a polyol component (A) and a polyisocyanate component (B), and prepared to have viscosity >=900 mPa.s at 80 deg.C right after mixing the component (A) and (B). The component (A) is a polyol having number average molecular weight >=800 or its mixture, and the preferable viscosity of the component (B) at 25 deg.C is >=20,000 mPa.s. The adhesive is usable for lamination of a metal foil having thickness of 5-15μm and a plastic film.
申请公布号 JP2001172602(A) 申请公布日期 2001.06.26
申请号 JP20000294424 申请日期 2000.09.27
申请人 TAKEDA CHEM IND LTD 发明人 IMAI AKIHIRO;MORIMOTO TAIJI;IGARASHI YUKIO
分类号 B32B15/08;B29C65/48;C09J175/04;(IPC1-7):C09J175/04 主分类号 B32B15/08
代理机构 代理人
主权项
地址