| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film which comprises a high density polyethylene resin, has smooth surfaces, a uniform thickness and good cuttability, does not leave a non-cut portion, when the film is notched with a cutter to leave a prescribed letter or mark on a separator, and is used for marking, and to provide a method for producing the substrate film for marking, characterized by calendering the high density polyethylene resin as a substrate resin. SOLUTION: This substrate film is used for marking, has a thickness of 40 to 150μm and comprises a resin composition comprising 100 pts.wt. of a high density polyethylene resin having a melt flow rate in a range of 0. 03 to 1.0 g/10 min and 3 to 30 pts. wt. of calcium carbonate having an average particle diameter of 0.05 to 2μm. The substrate film for marking can be obtained by calendering the above-resin composition into the film having a thickness of 40 to 150μm.
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