发明名称 ANISOTROPIC CONDUCTIVE CONNECTION MATERIAL HARDENED AT LOW-TEMPERATURE
摘要 PURPOSE: Provided is an anisotropic conductive connection material hardened at a low temperature, which can prevent accumulation of internal stress by reducing contraction due to hardening and can thus increase adhesive strength to improve conduction reliability and can enhance insulation property. CONSTITUTION: The anisotropic conductive connection material has an adhesive to connect a member, to be connected, having opposed electrodes. The adhesive contains a crosslinking-type radical polymeric resin component, a polymerization initiator, and an A-B type block copolymer having a compatible segment and an incompatible segment to the radical polymeric resin component.
申请公布号 KR20010051145(A) 申请公布日期 2001.06.25
申请号 KR20000061626 申请日期 2000.10.19
申请人 SONY CHEMICALS CORPORATION 发明人 ISHIMATSU TOMOYUKI
分类号 C09J9/02;C09J4/06;H01B1/22;H05K3/32;(IPC1-7):C09J9/02 主分类号 C09J9/02
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