发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PURPOSE: To increase a surface area by controlling the surface morphology of a storage node electrode at a capacity part. CONSTITUTION: A capacity part comprising at least a capacity insulating film 2 and a storage node electrode 1 contacting to the capacity insulating film 2 is provided. Here, a high melting-point metal nitride film is formed as the storage node electrode 1 into a form having a specified surface morphology, with the capacity insulating film 2 formed on the storage node electrode 1.
申请公布号 KR20010051216(A) 申请公布日期 2001.06.25
申请号 KR20000062633 申请日期 2000.10.24
申请人 NEC CORPORATION;TOKYO ELECTRON LIMITED 发明人 KAMIYAMA SATOSHI;KAWANO YUMIKO;YAMASAKI HIDEAKI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/04
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