ELECTRONIC COMPONENT WITH SHIELD CASE AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To provide a manufacturing method for an electronic component with high reliability shield case wherein the shield case is fixed to a board with sure, and the electronic component with high reliability shield case manufactured in the manufacturing method, without requiring a process for filling a joint hole with solder paste. CONSTITUTION: A claw 6 of the shield case 5 is inserted in the hole 2 of a mother board 11, and solder paste 7 is applied to a region containing at least a part of the circumference of the engaging claw 6 or the circumference of the engaging claw 6 and the engaging claw 6, of a reverse side surface (rear surface) to a component-mounted surface covered with the shield case 5 of the mother board 11. Under this condition, reflow soldering is performed to solder the engaging claw 6 of the shield case 5 to an electrode 13 for fixing case placed on an inner peripheral surface of the engagement hole 2, and then partitioning into separate electronic components with shield case is performed.