| 摘要 |
PURPOSE: An apparatus and a method of sylilation are to provide a uniform sylilated layer, without depending on the hardware constitution. CONSTITUTION: An apparatus and a method include carrying of a wafer W into a processing chamber, setting it while keeping a prescribed distance from a hot plate(5) established in the processing chamber, filling the processing chamber with a sylilation agent by introducing steam which contains a sylilation agent into the processing chamber heating the hot plate(5), bringing the wafer W close to the hot plate(5), uniformly spreading the sylilation agent atmosphere in the processing chamber at a temperature, at which the wafer W does not generate sylilation reaction, raising the temperature of the wafer W by bringing it close to the hot plate(5), and generating sylilation reaction on the surface of the wafer W.
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