APPARATUS FOR PROCESSING SUBSTRATE

摘要

PURPOSE: An apparatus for processing a substrate is provided to prevent an increasing phenomenon of an edge portion of a coated layer by coating uniformly a resist layer. CONSTITUTION: A spin chuck(10) is used for absorbing and keeping a wafer(W) and rotating and elevating the wafer(W). A supply nozzle(11) is formed on an upper portion of the spin chuck(10) in order to drop a resist solution on the wafer(W). The supply nozzle(11) is connected with a resist solution tank(14) through a supply tube(12) and a control valve(13). The supply nozzle(11) is formed at a front end portion of a Z drive portion(15) by a folder(17). A base portion of the Z drive portion(15) is supported by a Y-directional mobile portion(16). An air flow control plate(25) is installed at a gap between the wafer(W) and an inner circumference of a cup(24). An exhaust tube(30) is installed under the cup(24). The exhaust tube(30) is connected with a pump(32) through a control valve(31).