| 摘要 |
The ceramic carrier (10) has a chip capacitor (14) mounted on it with one terminal linked to a signal line (16) which forms the connection from a plug to the hybrid component. The other terminal is connected to a metallic coating (18) on the upper surface of the carrier, linked to a counterpart (22) on its underside (20) by a plated through hole (24). The entire structure is bonded (26) adhesively to a housing (28). A multilayer structure may be developed with a layer of glass in which the via hole is filled with conductive paste. ADVANTAGE - High frequency coupling to circuit is achieved without metallic housing. |
