| 摘要 |
PURPOSE: The structure of a chuck for picking up a semiconductor wafer with a heating function is provided to prevent from the breakage of the product by preventing the big temperature difference when the pickup part contacts to the bottom of the high temperature of semiconductor wafer or flat glass and to increase the productivity by preventing the deterioration, thus enforcing the competence of the product. CONSTITUTION: The chuck(101) for picking up the semiconductor wafer has a rotation connecter connected to an arm(103) of the rotating shaft for rotation and having a rotating hole on its one side. A pickup part(104) is connected to the rotation connecter in a longitudinal direction and absorbing either a wafer or an LCD panel. A radiant beam lamp is placed near the rotation connecter and generating the radiant heat. A heat condensing plate couples the radiant beam lamp in the form of a corn to receive, and condenses the radiant heat on the pick up.
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