发明名称 Chuck heater for improved planar deposition process
摘要 A method and apparatus for the flame hydrolysis deposition (FHD) of a core material on a substrate provides a holder for a substrate which is heated to a predetermined temperature selected to maintain the substrate temperature relatively constant during the FHD process. As a result, the thickness of a thin film applied to the substrate is relatively uniform as is the index of refraction of the core material deposited on the substrate. In one embodiment, a chuck for receiving a disk-shaped substrate wafer is supplied with an embedded electrical heater for maintaining the chuck temperature at from about 700° C. to about 900° C. In another embodiment, a gas heater positioned on a side of the chuck opposite the wafer mounting is provided to heat the chuck at substantially the same temperature. In either embodiment, a chuck is rotated with respect to a line-flame burner which introduces a vaporized mixture of organometallic material into the line-flame burner for depositing a thin film of from about 5 to 6.5 microns of doped glass on the wafer substrate.
申请公布号 AU1455301(A) 申请公布日期 2001.06.25
申请号 AU20010014553 申请日期 2000.11.02
申请人 CORNING INCORPORATED 发明人 HEATHER D. BOEK;ELIZABETH A. BOYLAN;HAIBO HUANG;PASCALE LABORDE;GARY L. LEWIS;WILLIAM P. RYSZYTIWSKYJ;PUSHKAR TANDON
分类号 C03B8/04;C03B19/14;C23C16/44;C23C16/453;C23C16/458;C23C16/46 主分类号 C03B8/04
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