发明名称 THERMALLY PEELING TYPE ADHESIVE SHEET
摘要 PURPOSE: To provide a thermally peeling type adhesive sheet which can ensure an effective contact surface, even when the contact-targeting area of an adherent is small, and can prevent the generation of adhesion troubles such as chip scattering. CONSTITUTION: This thermally peeling type adhesive sheet in which a thermally expandable adhesive layer containing thermally expandable fine spheres is disposed on at least one side of a substrate, characterized in that an average roughness on the central line of the surface of the thermally expandable adhesive layer is <= 0.4μm, before heated. The maximum roughness of the surface of the thermally expandable adhesive layer may be <= 5μm, before heated. The adhesive sheet may have a rubbery organic elastic layer between the substrate and the thermally expandable adhesive layer.
申请公布号 KR20010051480(A) 申请公布日期 2001.06.25
申请号 KR20000065734 申请日期 2000.11.07
申请人 NITTO DENKO CORPORATION 发明人 ARIMITSU YUKIO;KIUCHI KAZUYUKI;MURATA AKIHISA;OSHIMA TOSHIYUKI
分类号 B32B25/08;B32B27/00;B32B27/20;C09J5/08;C09J7/02;C09J7/04;C09J11/00;C09J201/00;(IPC1-7):C09J7/02 主分类号 B32B25/08
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