| 摘要 |
PURPOSE: An anisotropic conductive connection material is provided to be adhered mechanically without damaging a passivation film, obtain an electric connection between opposed electrodes, and maintain an insulation between neighboring electrodes, even in case a semiconductor device having a passivation film made of resin and electrodes at a low position than the film and a circuit board are connected. CONSTITUTION: The semiconductor device comprising electrodes(4) at a lower position than a passivation film(5) is connected to a circuit board(1) by connection material(6) having adhesive components(7) and conductive particles(8). The particles of which surface of macro molecular nucleus particles(8a) are covered with metal layer(8b), used as the conductive particles, are of diameter d of non less than 1.5 times the height difference between the passivation film(5) and the electrodes(4) and not more than 0.5 times the interval between the electrodes(4). |
