| 发明名称 |
ADHESIVE SILICONE SHEET AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE: To provide an adhesive silicone sheet of which the wire bondability or beam lead bondability is good after the bonding of a semiconductor chip to its mounting place and from which a release film optionally tightly kept in contact with the sheet is easily separable and to provide a semiconductor device excellent in reliability. CONSTITUTION: This adhesive silicone sheet comprises a crosslinked product of a crosslinkable silicone composition and is used for bonding a semiconductor chip to its mounting place. The sheet contains a spherical filler having a particle size not larger than the thickness of the sheet and having an average particle size of 50-100% of the thickness. The semiconductor device is prepared by bonding a semiconductor chip to its mounting place with the adhesive silicone sheet.</p> |
| 申请公布号 |
KR20010051669(A) |
申请公布日期 |
2001.06.25 |
| 申请号 |
KR20000067370 |
申请日期 |
2000.11.14 |
| 申请人 |
DOW CORNING TORAY SILICONE COMPANY LIMITED |
发明人 |
ISSHIKI MINORU;NAKAYOSHI KAZUMI;USHIO YOSHITO;YAMAKAWA KIMIO |
| 分类号 |
H01L21/52;C08J3/24;C08J5/18;C08K3/00;C08K5/541;C08K7/00;C08K7/16;C08L83/05;C08L83/07;C09J7/00;C09J183/04;C09J183/07;H01L21/50;H01L21/58;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/52 |
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