| 摘要 |
PURPOSE: A system and method for processing a substrate are provided to measure the thickness of a resist film coating a wafer by a peripheral exposure apparatus inside the substrate processing system. CONSTITUTION: In a peripheral exposure apparatus(51) in a coating development processing system, the thickness of a resist film on a wafer(W) is measured by a film thickness sensor(64) that senses the film thickness of the resist film by laser beam and moving the wafer(W) on a loading stand(61) in the X direction.
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