METHOD FOR CONTROLLING POLISHING MACHINE

摘要

PURPOSE: A method for controlling a polishing machine is provided to minimizes the difference between a predicted substrate profile and a desired substrate profile. CONSTITUTION: Several test substrates are polished with several parameter sets. A polishing profile is measured for each of the plurality of test substrates and a polishing time is calculated for each polishing parameter set which minimizes the difference between a predicted substrate profile and a desired substrate profile.