| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that the conventional optical inspecting apparatus mounts a wafer on a two-axial stage for inspecting the entire wafer surface and hence needs a large installing area at least 4 times as wide as the wafer area. SOLUTION: The optical inspecting apparatus irradiates the semiconductor wafer with a light beam, condenses light scattered from the semiconductor wafer with a condenser, acquires it at a light detector and detects the shape defects in the semiconductor wafer. This optical pattern inspecting apparatus detects the shape defects by moving the condenser.
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