| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing costs, freely arrange an element on a printed circuit board, and prevent ambient temperature from increasing in an electronic device with the printed circuit board, an enclosure, and a lid. SOLUTION: A case 12 of an ECU 10 is made of a plastic enclosure 1 and a metal lid 3, and a printed circuit board 2 is accommodated inside. A filler 6 that becomes the waterproof seal between the enclosure 1 and the lid 3 is obtained by injecting a liquid-shaped object before heating and hardening. Also, the filter 6 is filled between the printed circuit board 2 and the lid 3. Since the enclosure 1 and the lid 3 have been glued by the filter 6, dimensional tolerance needs not be strict, thus reducing manufacturing costs. Since heat being generated by an element is radiated to the fresh air through a path consisting of a printed circuit board 2, the filter 6, and the lid 3, the position of a specific element cannot be limited. Since heat is radiated from the entire printed circuit board 2, heat can be radiated from an entire heat generation element, thus efficiently preventing the ambient temperature in a case 12 from increasing.
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