METHOD FOR FORMING DUAL DAMASCENE EQUIPPED WITH AIR GAP

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a dual damascene with a dielectric layer formed on a substrate equipped with a first conductive line and an air gap. SOLUTION: A method for forming a dual damascene structure has a step for forming a dielectric layer on the first conductive line, a step for forming a via-hole opening so as to expose the first conductive line in the dielectric material and the dielectric layer so as to expose the first conductive line, and a step for forming a second conductive line and a via-plug by filling the trench and the via-hole opening with a conductive material.