发明名称 |
METHOD AND APPARATUS FOR TESTING PRODUCT WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for burn-in testing chips on a wafer at once. SOLUTION: The apparatus for testing a product/chips on a circular product wafer comprises an O-ring seal provided apart from the wafer so as to surround the wafer, a chuck having a vacuum port provided between the O-ring seal and the wafer, a first board having a probe contacting the chips on the wafer at one end and a contact at the other end, a second board having a tester chip mounted at one side and a contact connected to the contact of the first board at the other end, a test head having a peripheral part engaged with the O-ring seal, a means for selectively feeding a vacuum pressure to the vacuum port, and means for selectively moving the chuck in a direction parallel or perpendicular to the surface of the test head.
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申请公布号 |
JP2001168156(A) |
申请公布日期 |
2001.06.22 |
申请号 |
JP20000305671 |
申请日期 |
2000.10.05 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
PAUL M GASUKE;THOMAS W BACHELDER;DENISE R BARINGER;DENISE R CONCH;JAMES M CRAFTS;DAVID L GADEL;MARK R LAFOSSE;PERRY CHARLES H;DR ROGER R SKUMID;JOSEPH J VAN HORNE;WAYDE H WHITE |
分类号 |
G01R31/26;G01R1/06;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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