| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where the increase of a chip area can be prevented, a design period can be shortened and an operation can be recognized in a mounting state even in an IC chip where a circuit only for boundary scanning is not incorporated, and to provide the manufacturing method. SOLUTION: A first IC chip 1 and a second IC chip 2 constituted only of the circuit only for boundary scanning, which boundary-scans the first IC chip 1, are stored in a stacked package 3 in a stacked state. |
