发明名称 COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a component mounting machine and a component mounting method whereby the thermocompression bonding man-hours of components to a board is reduced, the bonding accuracy can be raised, and a high quality component mounting board can be manufactured at a low cost. SOLUTION: The component mounting machine comprises a first thermocompression unit 200 for holding and mounting a component 102 on a board 101, and for pressing and heating it to tentatively bond it; and a second thermocompression unit 240 for pressing and heating the tentatively bonded component to actually bond it.
申请公布号 JP2001168146(A) 申请公布日期 2001.06.22
申请号 JP19990350678 申请日期 1999.12.09
申请人 SONY CORP 发明人 KAWATANI NORIO;OSONIWA KAZUMASA;ICHIKAWA IWAO;YAMAUCHI MANABU
分类号 H05K3/32;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/32
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