| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor-wiring substrate, that has improved adhesion properties to the insulation substrate of a wiring pattern and has an improved yield, even if a fine wiring pattern is formed, a transfer medium for transferring conductor wiring to the insulation substrate of the conductor wiring substrate, and a method for easily manufacturing them. SOLUTION: A substrate surface is exposed selectively to the surface of an aluminum substrate 10 for transfer media by photoresist technique, a metal layer 104, where a metal particle mass growth direction is nearly in parallel with the substrate surface is formed on the exposed substrate surface, a meta layer 105, where the metal particle mass growth direction is nearly vertical to the substrate surface is formed by the non-luster plating, the obtained transfer medium is crimped to an insulation substrate 201 with an adhesive 202 on the surface, metal layers 104 and 105 that become conductor wiring are transferred and embedded onto the surface of the insulation substrate, and the substrate 101 of the transfer medium is chemically etched for removal, thus obtaining the wiring board.
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