| 摘要 |
PROBLEM TO BE SOLVED: To reduce the reflection of high-frequency signals being generated due to the mismatching of characteristic impedance at the lead junction part of a package for high-frequency circuits. SOLUTION: A package 21 is configured by laminating a plurality of dielectric ceramics layers 22-24, and a signal lead 25 is joined to the end of a high-frequency signal line on the upper surface of the dielectric ceramics layer 23 at a middle part. A ground layer 26 is formed on the lower surface of the dielectric ceramics layer 23, and a GND lead 2 7 is joined to a site that is located immediately below the signal lead 25 out of the ground layer 26. The signal lead 25 is connected to a high-frequency signal line on the upper surface of an external circuit substrate 28, and the GND lead 27 is connected to a GND pattern 29 on the lower surface of the external circuit substrate 28, thus allowing a GND current to flow immediately below the signal lead 25, reducing the path of the GND current near the lead junction part, and hence reducing the mismatching of the characteristic impedance of the lead junction part. |
