| 摘要 |
PROBLEM TO BE SOLVED: To compactly mount a semiconductor device on a wiring board so as to improve other parts in mounting efficiency. SOLUTION: Interlayer through-electrodes 18 and bump electrodes 19 are formed on a multilayer wiring board that serves as a base, and a semiconductor device 17 is mounted in a flip chip mounting manner, and thermosetting resin is applied thereon, then thermally cured, and ground to set the semiconductor device 17 as thick as prescribed, and an interlayer connection electrode 18 is exposed. A wiring electrode 21 is formed, thermosetting resin is applied thereon, and a multilayer board 13 is placed on the thermosetting resin, and the thermosetting resin is cured as a pressure is applied on the multilayer board 13, and the wiring electrode 21 and the multilayer wring board 13 are electrically connected together. Mounting structures 14 can be laminated in layers so as to be a laminated circuit module. A surface-mpounting device can be mounted on all the surfaces of the multilayer wiring boards 12 and 13, and a compact laminated circuit module of moderate thickness can be formed. |
