| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a high reliability by improving the adhesion of a layer insulation film to prevent the layer insulation film between wirings from peeling off and blocking cracks in the layer insulation film from propagating. SOLUTION: In the semiconductor device formed by laminating first dummy wirings, a layer insulation film and second dummy wirings in this order on a semiconductor chip and forming a plurality of dummy vias into the layer insulation film between the first and second dummy wirings, one of the first dummy wirings or the second dummy wirings is connected to the plurality of dummy vias. |
