| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a bonding material, such as the solder, can be supplied stably to a resin film substrate and, in addition, electronic parts, particularly, very small electronic parts which can be bonded at a low temperature can be mounted. SOLUTION: Lands 7 pre-coated with solder are formed on the resin film substrate 1 having a thickness of 30-100μm, and the very small electronic parts 3 are respectively mounted on the lands 7. It is preferable to adjust the area of each electrode 9 of the parts 3 bonded to each land 7 to 0.01-1 mm2 and the thickness of the pre-coated solder to 1-50μm.
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