HEAT SINK FOR SEMICONDUCTOR MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat sink for a semiconductor material and a semiconductor device using the heat sink. SOLUTION: A heat sink for a semiconductor material which uses a copper plate as its substrate has a graphite dispersed nickel plated layer, a nickel plated layer or a two-layer plated layer consisting of a nickel plated layer, and a graphite dispersed nickel plated layer as its lower layer. The heat sink has an electrolytic chromic acid treated layer as its upper layer or is formed with a nickel plated single layer. The heat sink and a semiconductor device using the heat sink are excellent in an adhesion to an adhesive film and are excellent also to such a heat resistance as a reflow resistance.