| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module of a structure that the manufacturing process of the module can be simplified. SOLUTION: In an electronic component module 1, one pair of upper and lower substrates 3 and 2 are provided. In a plurality of through holes at the lower first substrate 2, pins 7 and 9 are respectively penetrated through these holes 10. The pins 7 and 9 are projected on both sides of the upper and lower surfaces of the first substrate 2 and the sides of the lower ends of the pins 7 and 9 are used when the module 1 is mounted on a socket, while the sides of the upper ends of the pins 7 are used for soldering the pins 7 to connection 6 provided on the side of the lower surface of the second substrate 3. The positioning pin 9 is projected to the position higher than the pins 7 and is fitted into a through hole 8 formed in the substrate 3, whereby a positioning of the substrate 2 to the substrate 3 is performed. |
